contract chip maker, confirmed on Tuesday it is aiming to
manufacture bigger silicon wafers that could lower the cost of
chip production, but said technical difficulties will remain in
the next five years.
Monday, 11 June 2012
UPDATE 1-TSMC sees tech challenge in 450mm wafer race
TAIPEI, June 12 (Reuters) - TSMC, the world's top
contract chip maker, confirmed on Tuesday it is aiming to
manufacture bigger silicon wafers that could lower the cost of
chip production, but said technical difficulties will remain in
the next five years. 
contract chip maker, confirmed on Tuesday it is aiming to
manufacture bigger silicon wafers that could lower the cost of
chip production, but said technical difficulties will remain in
the next five years.
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